SIA406DJ-T1-GE3【PDF 1/9 页】MOSFET N-CH D-S 12V SC-70-6

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New Product

SiA406DJ

Vishay Siliconix

N-Channel 12-V (D-S) MOSFET

PRODUCT SUMMARY

FEATURES

V DS (V)

R DS(on) ( Ω )

0.0198 at V GS = 4.5 V

0.0222 at V GS = 2.5 V

0.0264 at V GS = 1.8 V

I D (A) a

4.5

Q g (Typ.)

13.7 nC

? Halogen-free According to IEC 61249-2-21

Definition

? TrenchFET ? Power MOSFET

? New Thermally Enhanced PowerPAK ?

SC-70 Package

- Small Footprint Area

- Low On-Resistance

PowerPAK SC-70-6L-Sin g le

? 100 % R g Tested

? Compliant to RoHS Directive 2002/95/EC

APPLICATIONS

? Load Switch for Portable Devices

Markin g Code

? DC/DC Converters

2.05 mm

Part # code

AHX

XXX

Lot Tracea b ility

and Date code

Orderin g Information: SiA406DJ-T1-GE3 (Lead (P b )-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted

N-Channel MOSFET

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

±8

4.5 a

Unit

Continuous Drain Current (T J = 150

Pulsed Drain Current

°C) a

T C = 70 °C

T A = 25 °C

T A = 70 °C

I D

I DM

4.5 a

4.5 a, b, c

Continuous Source-Drain Diode Current

T C = 25 °C

T A = 25 °C

T C = 25 °C

I S

4.5 a

2.9 b, c

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

3.5 b, c

T A = 70 °C

2.2 b, c

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) d, e

T J , T stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient b, f

Maximum Junction-to-Case (Drain)

t ≤ 5s

Steady State

R thJA

R thJC

5.3

6.5

°C/W

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile ( www.vishay.com/ppg?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

Document Number: 65361

S09-1924-Rev. A, 28-Sep-09

www.vishay.com

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